High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200
The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.
Features:
- Multilayer Capability
- System-in-Package Capability
- Ultrathin Die Bonding Technology
- Supermini Chip Bonding
- Quick Changeover
Main application:
IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power de vice, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.
Product Parameters:
| Item |
Specification |
| Placement accuracy |
±15um@3σ |
| Wafer size(mm) |
4"/6"/8"(Option:12") |
| Die size(mm) |
0.25*0.25mm-10*10mm |
| Substrate size(mm) |
L150×W50~L300×W100 |
| Substrate thickness(mm) |
0.1~2mm |
| Placement head |
0-360°rotation/Auto change nozzle(option) |
| Placement pressure(N) |
30～7500g |
| Glue feeding mode |
Support:dispensing,dipping glue,painting glue |
| Core motion module |
Linear motor + grating scale |
| Platform base of machine |
Marble platform |
| Loading/unloading |
Manual/auto |
| Machine dimension(L×W×H) |
1255mm×1625mm×1610mm |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ;
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.
5.The ground is required to withstand a pressure of 800kg/m².
Product Tags:
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Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment Images
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